PTFA181001GL - Thermally-Enhanced High Power RF LDMOS FET
PTFA181001GL Features
* include input and output matching, and thermally-enhanced open-cavity packages with copper flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA181001GL
* Package PG-63248-2 PTFA181001HL
* Package PG-642
