Description
IRF6616PbF IRF6616TRPbF RoHS compliant containing no lead or bormide l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible l Ultra Low Package I.
The IRF6616 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve low combined on-state and s.
Features
* e Pulse 0 1 10 100 1000
1.00
1
0.10
VGS = 0V 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VSD, Source-to-Drain Voltage (V)
0.1 VDS , Drain-to-Source Voltage (V)
Fig 10. Typical Source-Drain Diode Forward Voltage
120 100
ID, Drain Current (A)
Typical VGS(th) Gate threshold Voltage (V)
2.5
F
Applications
* PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best t