Description
PD - 96137 IRF6722SPbF IRF6722STRPbF l l l l l l l l l l RoHS Compliant Containing No Lead and Bromide Low Profile (<0.7 mm) Dual Sided Cooling Co.
The IRF6722SPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state res.
Features
* e Forward Voltage
Typical VGS(th) Gate threshold Voltage (V)
Fig11. Maximum Safe Operating Area
3.0
60 50
ID, Drain Current (A)
2.5
40 30 20 10 0 25 50 75 100 125 150 T C , Case Temperature (°C)
2.0
ID = 50µA ID = 150µA
1.5
ID = 250µA ID = 1.0mA ID = 1.0A
1.0 -75 -50 -25 0 25 50 75 100 125
Applications
* PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best t