* Silicon chip on Direct-Copper-Bond Maximum lead temperature for soldering Plastic body for 10s 50/60 Hz, RMS, 1 minute Mounting force 300 260 2500 20..120/4.5..27 5
* substrate - High power dissipation - Isolated moun
IXFR30N110P Datasheet (129.52 KB)
IXFR30N110P
IXYS Corporation
129.52 KB
Polar power mosfet hiperfet.
PolarTM Power MOSFET HiPerFETTM
N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode
Symbol VDSS VDGR VGSS VGSM ID25 IDM IAR EAS dV/dt PD T.
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