* W °C °C °C °C V~ g
* Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation
* Low drain to tab capacitance(
IXFR44N60 Datasheet (34.55 KB)
IXFR44N60
IXYS Corporation
34.55 KB
Power mosfet.
HiPerFETTM Power MOSFETs ISOPLUS247TM (Electrically Isolated Back Surface) Single MOSFET Die IXFR 44N60 VDSS = 600 V ID25 = 38 A RDS(on) = 130 mW tr.
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