IRF6798MPBF HEXFET Power MOSFET plus Schottky Diode
The IRF6798MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries us.
HEXFET® Power MOSFET plus Schottky Diode RoHs Compliant Containing No Lead and Bromide VDSS VGS RDS(on) RDS(on) l Integrated Monolithic Schottky Diode 25V max ±20V max 0.95mΩ@ 10V 1.6mΩ@ 4.5V l Low Profile (<0.7 mm) Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) l Dual Sided Cooling Compatible l Low Package Inductance 50nC 16nC 6.8nC 64nC 38nC 1.8V l Optimized for High Frequency Switching l Ideal for CPU Core DC-DC Converters l Optimized for Sync. FET socket of Sync. Buck Converter l Low Conduction a.
IRF6798MPBF Features
* MITED BY RDS(on) 100µsec
100
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
100
1msec
10
10msec DC
10 T J = 150°C 1 T J = 25°C T J = -40°C VGS = 0V 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 VSD, Source-to-Drain Voltage (V)
1
0.1
TA = 25°C TJ = 150°C
Single Pulse 0.