* Silicon Chip on Direct-Copper Bond (DCB) Substrate
* Isolated Mounting Surface
* Low Intrinsic Gate Resistance
* 2500V~ Electrical Isolation
* Fast Intrinsic Rectifier
* Avalanche Rated
* Low Package Inductance Advantages
* High Power Density
* Easy to Mount
IXFR64N50Q3 Datasheet (624.70 KB)
IXFR64N50Q3
IXYS
624.70 KB
Power mosfet.
Q3-Class HiperFETTM Power MOSFET (Electrically Isolated Tab) N-Channel Enhancement Mode Fast Intrinsic Rectifier IXFR64N50Q3 D G S Symbol VDSS VDGR .
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