PTFB191501F Features
* include input and output matching, and thermally-enhanced, RoHs-compliant package with slotted and earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFB191501E Package H-36248-2 PTFB191501F Package H-
PTFB191501E-InfineonTechnologies.pdf
Datasheet Details
PTFB191501F, PTFB191501E
Infineon ↗ Technologies
322.39 KB
Thermally-enhanced high power rf ldmos fets.
This datasheet PDF includes multiple part numbers: PTFB191501F, PTFB191501E.
Please refer to the document for exact specifications by model.
📁 Related Datasheet
📌 All Tags
